Multilayer 8 layer mixed layup Via Filled and capped, back drilled hole od CISTELAIER S.P.A.

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 Multilayer 8 layer mixed layup Via Filled and capped, back drilled hole
  •  Multilayer 8 layer mixed layup Via Filled and capped, back drilled hole
Application: Telecom
Technology: Multilayer 8 layer mixed layup Via Filled and capped, back drilled hole
Material: FR4 High TG with filler + Rogers RO4350. Via Filled and capped, back drilled hole
Finishing: Enig

Popis Produkt

Application: Telecom
Technology: Multilayer 8 layer mixed layup Via Filled and capped, back drilled hole
Material: FR4 High TG with filler + Rogers RO4350. Via Filled and capped, back drilled hole
Finishing: Enig

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