Multilayer 6 layer with laser via and UBGA pitch 0.4 mm via in pad resin filled od CISTELAIER S.P.A.

Produkt

Multilayer 6 layer with laser via and UBGA pitch 0.4 mm via in pad resin filled
  • Multilayer 6 layer with laser via and UBGA pitch 0.4 mm via in pad resin filled
Application: Medical
Technology: Multilayer 6 layer with laser via and UBGA pitch 0.4 mm via in pad resin filled
Material: FR4 High TG with filler Nelco N4000-29
Finishing: Blue solder mask and Enig

Popis Produkt

Application: Medical
Technology: Multilayer 6 layer with laser via and UBGA pitch 0.4 mm via in pad resin filled
Material: FR4 High TG with filler Nelco N4000-29
Finishing: Blue solder mask and Enig

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